They systematically reviewed the current processing flows for SiC wafers, substance removal mechanisms, and processing technologies, and supplied steering on long term directions for SiC wafer processing. The incorporation of SSIC into Digital equipment improves their reliability whilst at the same time cutting down thermal pressure and lengthening their operational https://www.facebook.com/permalink.php?story_fbid=pfbid02SU2JA3ERkPA8YvF6rd3D1Cb2uG7aQ1nY5f4f7hdqtAoyqUYTVbeJwSW2EnmfShZ9l&id=61562415773754&__cft__[0]=AZW0KrBzksklvH5ZksGoPIrYHT7ilCzDV0-IkqX6x-3aCKL_Q6wAz7XlrdxUu_ciLW7TqCsq6nTQAXmfYEGEWPhTs3uY2JQ6iHMOiUJaWsUMfaFKxKtBmzgR1Ml4Edf1uHdJlzUBrq6Mh1JL7kdEVUOYuLcwgDWaK_AOBbJDdIZxb2Kja_1JNIUDecmLrSSaA8zsL5PbApMxRrLG6ByfrKZ-&__tn__=%2CO%2CP-R