As the demand for more compact and efficient electronic devices grows, Advanced Packaging technologies are becoming pivotal in semiconductor manufacturing. One notable advancement is Panel-Level Packaging (PLP), which involves integrating multiple chips onto a single large panel. This approach enhances scalability and reduces production costs, making it ideal for high-volume manufactu... https://www.packaging-labelling.com/articles/panel-level-packaging-the-next-frontier-for-electronics-protection